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US 2016/0111561 A1Published application
Package structure with optical barrier, optical package structure and manufacturing methods thereof
AssigneeSensortek Technology Corp.
InventorsFeng-Jung Hsu, Chu-Yuan Yang, Yuan-Ching Hsu, Yi-Hua Chang
Life of this patent
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Abstract
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
Claims16
A package structure with an optical barrier, comprising:
- a substrate;
- an emitter for emitting disposed on the substrate;
- a detector for receiving the optical signal disposed on the substrate;
- an optical barrier disposed between the emitter and the detector for shielding the excess optical signal;
- and
- a package material used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
3 more elements
A method for forming optical package structure, comprising:
- providing a substrate, having an emitter for emitting and a detector for receiving the optical signal disposed thereon, and an optical barrier disposed between the emitter and the detector for shielding the excess optical signal disposed on the substrate;
- and
- using a package material to completely cover the optical barrier, the emitter and the detector.
Dependencies are inferred from the claim text.