Electronic device and method of manufacturing the same

An electronic device including at least one electronic component, comprising:

• a substrate;
• a semiconductor layer disposed on the substrate;
• an insulating layer disposed on the semiconductor layer and having a peripheral pattern corresponding to a peripheral pattern of the semiconductor layer;
• a first metal layer disposed on the insulating layer;
• a flexible layer disposed on the substrate and encapsulating the semiconductor layer, the insulating layer and the first metal layer, wherein the flexible layer has a Young's modulus less than 40 GPa;
• at least one first opening penetrating the flexible layer and the insulating layer;
• and
• at least one second metal layer disposed on the flexible layer and in the at least one first opening and electrically connected to the semiconductor layer.

A method of manufacturing an electronic device including at least one electronic component, comprising:

• forming a semiconductor layer on a substrate;
• forming an insulating layer on the semiconductor layer;
• forming a first metal layer on the insulating layer;
• performing a patterning process such that the insulating layer has a pattern corresponding to a pattern of one of the first metal layer and the semiconductor layer;
• forming a flexible layer on the substrate, wherein the flexible layer encapsulates the semiconductor layer, the insulating layer and the first metal layer, and has a Young's modulus less than 40 GPa;
• forming at least one first opening exposing a portion of the semiconductor layer;
• and
• forming at least one second metal layer on the flexible layer and in the at least one first opening and electrically connected to the semiconductor layer.