Semiconductor device and manufacturing method thereof
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHiroki ADACHI, Kayo KUMAKURA
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Abstract
Provided is a flexible device with fewer defects caused by a crack or a flexible device having high productivity. A semiconductor device including: a display portion over a flexible substrate, including a transistor and a display element; a semiconductor layer surrounding the display portion; and an insulating layer over the transistor and the semiconductor layer. When seen in a direction perpendicular to a surface of the flexible substrate, an end portion of the substrate is substantially aligned with an end portion of the semiconductor layer, and an end portion of the insulating layer is positioned over the semiconductor layer.
Claims13
A semiconductor device comprising:
- a flexible substrate;
- a semiconductor element over the flexible substrate;
- a semiconductor layer over the flexible substrate and along a periphery of the flexible substrate;
- and
- an insulating layer over the semiconductor element and the semiconductor layer,
- wherein the insulating layer comprises an opening over the semiconductor layer and along the periphery of the flexible substrate,
- wherein a first end portion of the semiconductor layer is covered with the insulating layer,
- wherein a second end portion of the semiconductor layer is exposed in the opening,
- wherein an end portion of the flexible substrate is substantially aligned with the second end portion of the semiconductor layer, and
- wherein the semiconductor layer and the opening surround the semiconductor element.
A semiconductor device comprising:
- a flexible substrate;
- a semiconductor element over the flexible substrate;
- a semiconductor layer over the flexible substrate and along a periphery of the flexible substrate;
- an insulating layer over the semiconductor element and the semiconductor layer;
- and
- a conductive layer between the semiconductor element and the semiconductor layer,
- wherein the insulating layer comprises an opening over the semiconductor layer and along the periphery of the flexible substrate,
- wherein a first end portion of the semiconductor layer is covered with the insulating layer,
- wherein a second end portion of the semiconductor layer is exposed in the opening,
- wherein an end portion of the flexible substrate is substantially aligned with the second end portion of the semiconductor layer, and
- wherein the semiconductor layer, the opening, and the conductive layer surround the semiconductor element.
Dependencies are inferred from the claim text.