Method of forming a vertical device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsDE-FANG CHEN, Teng-chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsDE-FANG CHEN, Teng-chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
Estimating the term…
According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
A method of forming a vertical device, comprising:
A method of forming a vertical device, comprising:
A vertical device, comprising:
Dependencies are inferred from the claim text.