Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device

A light-emitting device comprising:

• a light-emitting portion comprising:
• a first flexible substrate;
• a first insulating layer;
• a first bonding layer between the first flexible substrate and the first insulating layer;
• a second flexible substrate;
• a second bonding layer between the second flexible substrate and the first insulating layer;
• and
• a first functional layer between the second bonding layer and the first insulating layer;
• and
• a non-light-emitting portion comprising:
• the first flexible substrate;
• the first bonding layer;
• the first insulating layer;
• the second bonding layer;
• and
• the second flexible substrate,
• wherein the first bonding layer and the second bonding layer partly overlap with each other with the first insulating layer positioned therebetween,
• wherein the first functional layer comprises a light-emitting element, and
• wherein a gap between the first flexible substrate and the second flexible substrate is smaller in at least part of the non-light-emitting portion than in the light-emitting portion.

A manufacturing method of a light-emitting device, comprising first to fifth steps,

• wherein the first step comprises a step of forming a light-emitting element over a first substrate,
• wherein the second step comprises a step of forming a bonding layer and a partition over the first substrate or a second substrate,
• wherein the third step comprises a step of making the first substrate and the second substrate overlap with each other under a first atmosphere to position the light-emitting element in a space surrounded by the partition, the first substrate, and the second substrate,
• wherein the fourth step comprises a step of exposing the first substrate and the second substrate to a second atmosphere to fill part of the space with the bonding layer, to make the bonding layer spread toward an end portion of the light-emitting device, and to make the end portion of the light-emitting device comprise a smaller thickness than a middle portion of the light-emitting device,
• wherein the fifth step comprises a step of curing the bonding layer and the partition under the second atmosphere,
• wherein the first atmosphere has a lower pressure than the second atmosphere, and
• wherein in the second step, the partition is formed to surround the bonding layer with a gap left between the partition and the bonding layer.

A manufacturing method of a light-emitting device, comprising first to fifth steps,

• wherein the first step comprises a step of forming a light-emitting element over a first substrate,
• wherein the second step comprises a step of forming a bonding layer over the first substrate or a second substrate,
• wherein the third step comprises a step of making the first substrate and the second substrate overlap with each other to surround the light-emitting element with the bonding layer, the first substrate, and the second substrate,
• wherein the fourth step comprises a step of applying pressure to the bonding layer with a member comprising a projection to make an end portion of the light-emitting device comprise a smaller thickness than a middle portion of the light-emitting device, and
• wherein the fifth step comprises a step of curing the bonding layer.