Batch contacts for multiple electrically conductive layers

A method of fabricating a multilevel structure, comprising:

• forming a stack comprising an alternating plurality of sacrificial material layers and insulator layers over a substrate;
• patterning the stack to form a stepped structure in which each overlying layer in the stack does not protrude more than any underlying layer in the stack;
• and
• forming a contact via structure directly on surfaces of at least two electrically conductive layers within the stack.

A method of fabricating a multilevel structure, comprising:

• forming a stack comprising an alternating plurality of sacrificial material layers and insulator layers over a substrate;
• patterning the stack to form a stepped structure in which each overlying layer in the stack does not protrude more than any underlying layer in the stack, wherein at least two sacrificial material layers have vertically coincident sidewalls after formation of the stepped structure;
• forming a sacrificial spacer on the vertically coincident sidewalls of the at least two sacrificial material layers;
• and
• replacing the materials of the sacrificial material layers and the sacrificial spacer with a conductive material, whereby electrically conductive layers are formed in volumes of the sacrificial material layers and a conductive material spacer is formed in a volume of the sacrificial spacer.