Light emitting diodes and a method of packaging the same

A method of assembling an array of light emitting diode (LED) dies on a substrate comprising:

• positioning dies in fluid;
• exposing the dies to a magnetic force to attract the dies onto a front side of a substrate using magnets that are arranged at pre-determined locations either directly on the backside of the substrate or near the backside of the substrate;
• and
• forming permanent electrical and/or mechanical connections between the dies and the substrate thereby constituting an array of LED dies on a substrate,
• wherein the exposing further comprises exposing the dies to a magnetic force that is arranged either on or beneath the substrate and beneath a surface of the fluid to sink the dies beneath the surface of the fluid and onto respective ones of the magnets that are arranged either on or near the substrate.