Top-side interconnection substrate for die-to-die interconnection
AssigneeGlobalfoundries Inc.
InventorTak Ming Mak
Life of this patent
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Abstract
At least one method, apparatus and system disclosed involves a multi-die integrated circuit device. A first substrate portion having a first height is formed. A first device over the first substrate portion is formed. A second substrate portion having a second height is formed. A second device is formed over the second substrate portion. An interconnect substrate feature is formed above the first and second devices. The interconnect substrate is configured to accommodate a plurality of interconnect lines electrically coupling the first and second devices.
Claims20
A method for providing a multi-die integrated circuit device, comprising:
- forming a first substrate portion having a first height;
- placing a first device over said first substrate portion;
- forming a second substrate portion having a second height;
- placing a second device over said second substrate portion;
- and
- forming an interconnect substrate feature above said first and second devices, wherein said interconnect substrate being configured to accommodate a plurality of interconnect lines for electrically coupling said first and second devices.
An integrated circuit device, comprising:
- a substrate comprising a first substrate portion having a first height and a second substrate portion having a second height;
- a first device positioned above said first substrate portion;
- a second device positioned above said second substrate portion;
- and
- an interconnect substrate feature positioned above said first and second devices, wherein said interconnect substrate feature comprises a plurality of interconnection lines for electrically coupling said first and second devices.
A system, comprising:
- a semiconductor device processing system to provide an integrated circuit device, wherein said integrated circuit device comprises:
- a substrate comprising a first substrate portion having a first height and a second substrate portion having a second height;
- a first device positioned above said first substrate portion;
- a second device positioned above said second substrate portion;
- and
- an interconnect substrate feature positioned above said first and second devices, wherein said interconnect substrate feature comprises a plurality of interconnection lines for electrically coupling said first and second devices;
- and
- a processing controller operatively coupled to said semiconductor device processing system, said processing controller configured to control an operation of said semiconductor device processing system.
Dependencies are inferred from the claim text.