Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
AssigneeFreescale Semiconductor, Inc.
InventorWENG F. YAP
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Abstract
Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.
Claims20
A System-In-Package (SiP), comprising:
- a first package comprising:
- a first molded package body having a sidewall;
- and
- a first leadframe embedded within the first molded package body and having a first leadframe lead exposed through the sidewall;
- and
- a Surface Mount Device (SMD) mounted to the sidewall of the first molded package body and having a first terminal ohmically contacting the first leadframe lead exposed through the sidewall of the first molded package body.
A System-In-Package (SiP), comprising:
- a first package comprising a first leadframe embedded within a first molded package body, the first leadframe having a first leadframe lead extending to a first sidewall of the first molded package body;
- a second package bonded to the first package in a stacked configuration, the second package comprising a second leadframe embedded within a second molded package body, the second leadframe having a second leadframe lead extending to a second sidewall of the second molded package body;
- and
- a Surface Mount Device (SMD) having first and second terminals, the SMD mounted to the first and second sidewalls such that the first terminal of the SMD electrically contacts the first leadframe lead and the second terminal of the SMD electrically contacts the second leadframe lead;
- wherein the SMD is selected from the group consisting of a discrete two terminal resistor providing a known resistance between the first and second leadframe leads, a discrete two terminal capacitor providing a known capacitance between the first and second leadframe leads, and a discrete two terminal inductor providing a known inductance between the first and second leadframe leads.
A System-In-Package (SiP), comprising:
- a first molded package body having a sidewall;
- a semiconductor die embedded within the first molded package body;
- a Surface Mount Device (SMD) bonded to the sidewall of the first molded package body and having a first terminal;
- and
- a leadframe embedded within the first molded package body, the leadframe comprising:
- a leadframe body;
- and
- first and second leadframe leads extending from the leadframe body to the sidewall to electrically contact the first terminal of the SMD.
Dependencies are inferred from the claim text.