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US 2016/0111400 A1Published application
Light emitting device
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsHOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
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Abstract
A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation.
Claims12
A light emitting diode packaging configured to be coupled to a circuit, the light emitting diode packaging comprising:
- a light emitting diode having a P electrode, an N electrode and a light exiting surface opposite to the P electrode and the N electrode;
- an encapsulation layer covering the light emitting diode, while leaving the P electrode and N electrode at least partially exposed from the encapsulation layer;
- and
- wherein the P electrode and the N electrode is configured to be coupled to the circuit.
1 more element
A light emitting device, comprising:
- a light emitting diode packaging comprising:
- a plurality of light emitting diodes, each light emitting diode having a P electrode and an N electrode thereon and a light exiting surface opposite to the P electrode and N electrode;
- an encapsulation layer covering the light emitting diodes with the P electrodes and N electrodes exposed out of the encapsulation layer;
- and
- a circuit including a plurality of positive electrodes coupled with the corresponding P electrodes and a plurality of negative electrodes coupled with the corresponding N electrodes.
2 more elements
Dependencies are inferred from the claim text.