Method for permanent bonding of wafers
AssigneeEV Group E. Thallner GmbH
InventorsThomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
Life of this patent
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Abstract
A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
Claims15
Method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, said method comprising:
- forming a reservoir in a surface layer of the first contact surface;
- at least partially filling of the reservoir with one or more first educts;
- forming a prebond connection by contacting the first contact surface with the second contact surface;
- and
- forming a permanent bond between the first and second contact surface, said permanent bond at least partially strengthened by reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
Dependencies are inferred from the claim text.