Solderless Mounting for Semiconductor Lasers
AssigneeSpectraSensors, Inc.
InventorsAlfred Feitisch, Gabi Neubauer, Mathias Schrempel
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Abstract
A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.
Claims14
A method comprising:
- forming a first contact surface of a semiconductor laser chip to a first target surface roughness and a second contact surface of a carrier mounting to a second target surface roughness;
- contacting the first contact surface with the second contact surface;
- and
- performing a solderless securing process to further secure the semiconductor laser chip to the carrier mounting.
2-22. (canceled)
28-49. (canceled)
An article of manufacture as in claim 28, wherein the solderless attachment comprises at least one of the following:
- an adhesive composition applied around at least part of a perimeter of an interface between the first contact surface and the second contact surface;
- and
- a device applying a mechanical force normal to the second contact surface, the mechanical force being applied to a top surface of the semiconductor laser chip and urging the first contact surface into contact with the second contact surface, the top surface of the semiconductor laser chip being at least approximately opposite to the first contact surface.
(canceled)
Dependencies are inferred from the claim text.