Method and Apparatus for Connecting Packages onto Printed Circuit Boards

A method of forming a device, comprising:

• providing an integrated circuit (IC) package comprising a connector and an IC;
• providing a printed circuit board (PCB) comprising a PCB contact pad;
• forming a molding compound over the connector, wherein the molding compound encapsulates a portion of the connector and has a topmost surface from which a second portion of the connector protrudes;
• providing a polymer flux on the PCB contact pad;
• connecting the PCB contact pad and the connector with the polymer flux between the connector and the PCB contact pad;
• and
• reflowing the device to make a connection between the connector and the PCB contact pad, wherein the polymer flux covers at least a part of the connector, and wherein the polymer flux flows over a portion of the topmost surface of the molding compound.

A method of forming a device, comprising:

• providing a first component having a first connection element formed thereon;
• forming a molding compound over the first component;
• providing a second component having a PCB contact pad formed thereon;
• after forming the molding compound, applying a polymer flux to the PCB contact pad and the first component, the polymer flux including a fluxing component and a polymer component;
• aligning and contacting the first connection element to the second connection element;
• and
• reflowing the first connection element and the second connection element to form a bond therebetween, wherein the polymer component of the polymer flux covers at least a part of the first connection element after the step of reflowing.