US 2016/0111390 A1 · METHOD FOR MANUFACTURING ELECTRONIC DEVICES

Abstract

An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

Claims20

Dependent claims

An integrated circuit, comprising:

a substrate having a surface;
a conductive pad disposed adjacent to the surface;
a conductive strip having a first end attached to the pad and having a contact region spaced from the substrate;
and
a package covering the conductive pad and disposed between the substrate and the contact region of the conductive strip such that a portion of the contact region is exposed through the package and the portion is approximately parallel to the surface of the substrate.

2 more elements

Dependencies are inferred from the claim text.

Method for manufacturing electronic devices

Life of this patent

Method for manufacturing electronic devices

Life of this patent

Abstract

Claims20