Bond pad structure for low temperature flip chip bonding
AssigneeGlobalfoundries Inc.
InventorsLuke ENGLAND, Christian KLEWER
Life of this patent
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Abstract
Methods for preparing 3D integrated semiconductor devices and the resulting devices are disclosed. Embodiments include forming a first and a second bond pad on a first and a second semiconductor device, respectively, the first and the second bond pads each having plural metal segments, the metal segments of the first bond pad having a configuration different from a configuration of the metal segments of the second bond pad or having the same configuration as a configuration of the metal segments of the second bond pad but rotated with respect to the second bond pad; and bonding the first and second semiconductor devices together through the first and second bond pads.
Claims20
A method comprising:
- forming a first and a second bond pad on a first and a second semiconductor device, respectively, the first and the second bond pads each having plural metal segments, the metal segments of the first bond pad having a configuration different from a configuration of the metal segments of the second bond pad or having the same configuration as a configuration of the metal segments of the second bond pad but rotated with respect to the second bond pad;
- and
- bonding the first and second semiconductor devices together through the first and second bond pads.
A method comprising:
- forming a first bond pad with metal segments forming a pattern having a first orientation on a first semiconductor device;
- forming a second bond pad with metal segments forming a pattern having a second orientation on a second semiconductor device, wherein the first orientation is at a 45 degree to a 90 degree angle with respect to the second orientation;
- and
- bonding the first and second semiconductor devices together through the first and second bond pads.
A device comprising:
- a first and a second semiconductor device having first and second bond pads, respectively, bonded together through the first and second bond pads, the first and second bond pads each having plural metal segments, the metal segments of the first bond pad having a configuration different from a configuration of the metal segments of the second bond pad or having a configuration rotated with respect to a configuration of the metal segments of the second bond pad.
Dependencies are inferred from the claim text.