Semiconductor structure including a die seal leakage detection material, method for the formation thereof and method including a test of a semiconductor structure

A semiconductor structure, comprising:

• a semiconductor substrate;
• one or more interconnect layers provided over said substrate;
• a circuit, said circuit comprising a plurality of circuit elements formed on said substrate and a plurality of electrical connections provided in said one or more interconnect layers;
• a die seal provided in said one or more interconnect layers, said die seal surrounding at least said pluarity of electrical connections of said circuit;
• and
• a die seal leakage detection material arranged in said one or more interconnect layers between said die seal and said plurality of electrical connections, wherein said die seal leakage detection material surrounds at least said plurality of electrical connections of said circuit, and wherein said die seal provides a protection of said die seal leakage detection material from moisture if said die seal is intact, said die seal leakage detection material being configured for providing a detectable modification of said circuit after an exposure of said die seal leakage detection material to moisture.