New structure of microelectronic packages with edge protection by coating
AssigneeGeorgia Tech Research Corporation
InventorsVenkatesh SUNDARAM, Vanessa SMET, Rao R. TUMMALA
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Abstract
Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages.
Claims20
coated microelectronic package comprising:
- a microelectronic package having a top, a bottom, and an exposed edge;
- and
- a coating comprising a polymer,
- wherein the microelectronic package comprises a glass substrate;
- and
- wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package.
A method of edge-coating a microelectronic package, the method comprising:
- providing a microelectronic package comprising a glass substrate, wherein the microelectronic package has a top, a bottom, and an exposed edge;
- and
- coating at least a portion of the top, at least a portion of the bottom, and a portion of the exposed edge of the microelectronic package with a coating comprising a polymer.
Dependencies are inferred from the claim text.