Molded Device with Anti-delamination Structure Providing Multi-layered Compression Forces
AssigneeHong Kong Applied Science and Technology Research Institute Company Limited
InventorsLourdito OLLERES, YUEPING YE, Man Kai CHEUNG
Life of this patent
Estimating the term…
Abstract
The present invention provides a molded encapsulated multi-layered semiconductor device, comprising a first substrate, a second substrate and an anti-delamination structure (ADS). The ADS comprises a connecting part and extended structures, and is filled by an insulating material. The present invention is able to provide the molded semiconductor device with higher reliability and longer lifetime through reduction of shear stress generated from the coefficient of thermal expansion mismatch between a silicon die and the substrates by mechanically locking with the ADS.
Claims20
A molded encapsulated multi-layered semiconductor device comprising:
- a first substrate comprising at least one first composite layer and at least one first through hole;
- a second substrate comprising at least one second composite layer and at least one second through hole;
- and
- at least one anti-delamination structure (ADS), made of an insulating material filled in between the first substrate and the second substrate;
- wherein the ADS comprises a connecting part passing through the first through hole and the second through hole, a first extended structure and a second extended structure;
- and
- wherein the first extended structure and the second extended structure are located on both sides of the connecting part respectively, and have larger cross sectional area than that of the connecting part, providing a compression force to prevent delamination of the multi-layered semiconductor device.
Dependencies are inferred from the claim text.