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US 2016/0111376 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsByoung-rim SEO, Woon-bae KIM, Young-doo JUNG
Life of this patent
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Abstract
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.
Claims19
A semiconductor package comprising:
- a semiconductor chip having an active surface and a non-active surface opposite to the active surface;
- a ground member on the active surface of the semiconductor chip;
- and
- an electromagnetic shielding member passing through the semiconductor chip and electrically connected to the ground member, and the electromagnetic shielding member covering at least some regions of the non-active surface of the semiconductor chip.
1 more element
A semiconductor package comprising:
- a semiconductor chip having an active surface and a non-active surface opposite to the active surface;
- a ground member spaced apart from an edge of the active surface of the semiconductor chip;
- a penetration hole passing through the semiconductor chip and exposing the ground member;
- a first electromagnetic shielding member filling at least some portion of the penetration hole and electrically connected to the ground member;
- and
- a second electromagnetic shielding member connected to the first electromagnetic shielding member and covering at least some portion of the non-active surface of the semiconductor chip.
3 more elements
A semiconductor package comprising:
- a semiconductor chip having an active surface and a non-active surface opposite to the active surface;
- at least one ground member on the active surface;
- and
- an electromagnetic shielding structure connected to the at least one ground member, the electromagnetic shielding structure including a plurality of pillar shape electromagnetic shielding members, the plurality of pillar shape electromagnetic shielding members passing through the semiconductor chip while being proximate to a side surface of the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.