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US 2016/0111367 A1Published application
Power semiconductor module and method for manufacturing the same
AssigneeHyundai Motor Company
InventorSung-Min PARK
Life of this patent
Estimating the term…
Abstract
A power semiconductor module may include a first device and a second device spaced apart from the first device at a predetermined interval. A first assembling terminal is fixedly disposed between the first device and the second device to be a first connection terminal. A second assembling terminal is fixedly assembled to contact outer surfaces of the first device and the second device to be a second connection terminal.
Claims20
A power semiconductor module, comprising:
- a first device;
- a second device spaced apart from the first device at a predetermined interval;
- a first assembling terminal fixedly disposed between the first device and the second device to be a first connection terminal;
- and
- a second assembling terminal fixedly disposed to contact outer surfaces of the first device and the second device to be a second connection terminal.
2 more elements
A method for manufacturing a power semiconductor module, comprising steps of:
- placing a first device and placing a second device to be spaced apart from the first device at a predetermined interval;
- assembling fixedly a first assembling terminal which is a first connection terminal to place the first assembling terminal between the first device and the second device;
- and
- assembling fixedly a second assembling terminal which is a second connection terminal to allow the second assembling terminal contacting outer surfaces of the first device and the second device.
1 more element
Dependencies are inferred from the claim text.