Chip package structure
AssigneeChipMOS Technologies Inc.
InventorTsung-Jen Liao
Life of this patent
Estimating the term…
Abstract
A chip package structure is provided. The chip package structure includes a chip, at least one inducting coil, a molding compound and a redistribution circuit layer. The chip includes an active surface, a back surface opposite to the active surface. The inducting coil is disposed around a periphery region of the chip. The molding compound covers the chip and the periphery region and exposes the active surface. The inducting coil is disposed at the molding compound. The redistribution circuit layer covers the active surface, part of the molding compound and part of the inducting coil, and electrically connects the chip.
Claims20
A chip package structure, comprising:
- a chip, comprising an active surface and a back surface opposite to the active surface;
- a plurality of heat dissipating pillars, disposed around a periphery region of the chip;
- a molding compound, covering the chip and the periphery region and exposing the active surface, wherein the heat dissipating pillars are disposed at the molding compound, and the molding compound exposes a part of each of the heat dissipating pillars;
- and
- a redistribution circuit layer, covering the active surface and a part of the molding compound, and the redistribution circuit layer being electrically connected with the chip.
A chip package structure, comprising:
- a chip, comprising an active surface and a back surface opposite to the active surface;
- at least one inducting coil, disposed around a first periphery region of the chip;
- a plurality of heat dissipating pillars, disposed around a second periphery region of the chip, wherein the first and second periphery regions are not overlapped with each other;
- a molding compound, covering the chip, the first periphery region, and the second periphery region, and the molding compound exposing the active surface, wherein the inducting coil and the heat dissipating pillars are disposed on the molding compound, and the molding compound exposes a part of each of the heat dissipating pillars;
- and
- a redistribution circuit layer, covering the active surface and a part of the molding compound, and the redistribution circuit layer being electrically connected with the chip.
Dependencies are inferred from the claim text.