Back to results
US 2016/0111358 A1Published application
Semiconductor package
AssigneeMediatek Inc.
InventorsWen-Sung HSU, Tzu-Hung LIN, Ta-Jen YU
Life of this patent
Estimating the term…
Abstract
A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. First and second conductive traces are disposed on the substrate. A conductive pillar bump is disposed on the second conductive trace, and a first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate. A semiconductor die is disposed over the first conductive trace, wherein the conductive pillar bump connects to the semiconductor die.
Claims20
A semiconductor package, comprising:
- a substrate;
- a first conductive trace disposed on the substrate;
- a second conductive trace disposed on the substrate;
- a conductive pillar bump disposed on the second conductive trace;
- a first conductive structure disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate;
- and
- a semiconductor die disposed over the first conductive trace, wherein the conductive pillar bump connects to the semiconductor die.
4 more elements
Dependencies are inferred from the claim text.