Semiconductor device

A semiconductor device, comprising:

• a chip mounting part;
• a first semiconductor chip that has a first principal plane and a second principal plane being an opposite side plane to the first principal plane and is mounted over the chip mounting part in a direction in which the second principal plane faces the chip mounting part;
• and
• a second semiconductor chip that has a third principal plane and a fourth principal plane being an opposite side plane to the third principal plane and a part of which is mounted over the first semiconductor chip in a direction in which the third principal plane faces the first principal plane,
• wherein in plane view, the chip mounting part has a notch part and a part of the second semiconductor chip overlaps the notch part, and further
• wherein the semiconductor device comprises:
• an electrode pad located in a region of the third principal plane of the second semiconductor chip that overlaps the notch part;
• and
• a bonding wire whose one end couples to the electrode pad.