Electronic device with first and second contact pads and related methods
AssigneeSTMicroelectronics (Shenzhen) R&D Co. Ltd
InventorJING-EN LUAN
Life of this patent
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Abstract
An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.
Claims25
1-24 (canceled)
An electronic device comprising:
- a plurality of leads;
- an integrated circuit (IC) comprising first and second pluralities of bond pads;
- an encapsulation material adjacent said plurality of leads and said IC so said plurality of leads extends to a bottom surface of said encapsulation material with lowermost portions defining a first plurality of contact pads;
- a plurality of bond wires between said first plurality of bond pads and corresponding ones of said plurality of leads;
- and
- a plurality of conductors extending from corresponding ones of said second plurality of bond pads to the bottom surface of said encapsulation material defining a second plurality of contact pads;
- said first and second pluralities of contact pads being aligned with each other adjacent the bottom surface of said encapsulation material.
An electronic device comprising:
- a plurality of leads;
- an integrated circuit (IC) comprising first and second pluralities of bond pads;
- an encapsulation material adjacent said plurality of leads and said IC so said plurality of leads extends to a bottom surface of said encapsulation material with lowermost portions defining a first plurality of contact pads arranged adjacent a periphery of the bottom surface;
- a plurality of bond wires between said first plurality of bond pads and corresponding ones of said plurality of leads;
- and
- a plurality of conductors extending from said second plurality of bond pads to the bottom surface of said encapsulation material defining a second plurality of contact pads arranged within the plurality of first contact pads;
- said first and second pluralities of contact pads being aligned with each other adjacent the bottom surface of said encapsulation material.
A method for making an electronic device comprising:
- coupling a plurality of wire bonds between a first plurality of bond pads of an integrated circuit (IC) and corresponding ones of a plurality of leads;
- coupling a plurality of conductors to extend outwardly from a second plurality of bond pads of the IC;
- and
- forming an encapsulation material adjacent the plurality of leads and the IC so the plurality of leads extend to a bottom surface of the encapsulation material with lowermost portions defining a first plurality of contact pads;
- the plurality of conductors extending to the bottom surface of the encapsulation material and defining a second plurality of contact pads aligned with the first plurality of contact pads adjacent the bottom surface of the encapsulation material.
Dependencies are inferred from the claim text.