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US 2016/0111353 A1Published application
Embedding thin chips in polymer
AssigneeMC10, Inc.
InventorsConor Rafferty, Mitul Dalal
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Abstract
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can he generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Claims2
An apparatus comprising:
- A) a substrate comprising a standoff well region, wherein:
- the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer;
- and
- a patterned portion of the first conductive material comprises a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region;
- and
- B) a thin chip disposed within the standoff well region on a portion of the exposed flexible polymer proximate to the standoff;
- wherein a height of the standoff is comparable to a height of the thin chip.
4 more elements
2-66. (canceled)
Dependencies are inferred from the claim text.