Methods of Cooling Packaged Semiconductor Devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKim Hong Chen, Szu-Po Huang, Shin-Puu Jeng, Wensen Hung
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Abstract
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions.
Claims20
A method of cooling a packaged semiconductor device, the method comprising:
- providing a package, wherein the package includes a substrate, a cover coupled to a perimeter of the substrate, a plurality of members disposed between the substrate and the cover, and a plurality of outer partitions, wherein each of the plurality of outer partitions is disposed between two adjacent members of the plurality of members and extends between the substrate and the cover, wherein the package further includes an inlet port coupled to the cover and an outlet port coupled to one of the plurality of outer partitions and further includes a ring member that allows fluid flow between an inner partition that defines a device mounting region and a first one of the plurality of outer partitions and a second portion that prevents fluid flow between the inner partition and a second one of the plurality of outer partitions;
- coupling a semiconductor device to the device mounting region of the substrate of the package;
- and
- passing a fluid from the inlet port of the package and over a top surface of the semiconductor device, through at least one of the plurality of outer partitions, under a bottom surface of the semiconductor device, and to the outlet port of the package.
A method of cooling a packaged semiconductor device, the method comprising:
- flowing a fluid through an inlet port into a package;
- causing the fluid to flow:
- radially outward from the inlet port across a top surface of a semiconductor device mounted within an inner partition defined by an inner ring member,
- thence to flow through apertures in the inner partition into respective first outer partitions, the respective first outer partitions defined at least in part by the inner ring member, an outer ring member, and respective elongated members disposed between a substrate and a cover,
- thence to flow underneath the semiconductor device,
- thence to flow from underneath the semiconductor device to respective second outer partitions, and
- flowing the fluid from the respective second outer partitions through an outlet port.
A method comprising:
- coupling a fluid source to a package;
- flowing fluid from the fluid source to an inlet port of the package;
- then
- flowing the fluid from the inlet port to an inner partition in which is mounted a semiconductor device and flowing the fluid across cooling fins on a top major surface of the semiconductor device;
- then
- flowing the fluid from the inner partition through an aperture to a first outer partition;
- then
- flowing the fluid across conductive bumps on a bottom major surface of the semiconductor device;
- then
- flowing the fluid into a second outer partition;
- and
- flowing the fluid from the second outer partition to an outlet port.
Dependencies are inferred from the claim text.