Packaged semiconductor devices
AssigneeTexas Instruments Incorporated
InventorMark A. Gerber
Life of this patent
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Abstract
A semiconductor device has a semiconductor chip having a first surface with metallized terminals and a parallel second surface. A frame of insulating material adheres to at the sidewalls of the chip. The frame has a first surface planar with the first chip surface and a parallel second surface planar with the second chip surface. The first frame surface includes one or more embedded metallic fiducials extending from the first surface to the insulating material. At least one film of sputtered metal extends from the terminals across the surface of the polymeric layer to the fiducials. The film is patterned to form extended contact pads over the frame and rerouting traces between the chip terminals and the extended contact pads. The film adheres to the surfaces.
Claims8
1-12. (canceled)
A semiconductor device comprising:
- a semiconductor chip having a first surface with metallized terminals, and a parallel second surface;
- a frame of insulating material adhering to at the sidewalls of the chip, the frame having a first surface planar with the first chip surface and a parallel second surface planar with the second chip surface, the first frame surface including one or more embedded metallic fiducials extending from the first surface to the insulating material;
- and
- at least one film of sputtered metal extending from the terminals across the surface of the polymeric layer to the fiducials, the film patterned to form extended contact pads over the frame and rerouting traces between the chip terminals and the extended contact pads, the film adhering to the surfaces.
Dependencies are inferred from the claim text.