Method and apparatus for characterizing metal oxide reduction
AssigneeLam Research Corporation
InventorsEdward C. Opocensky, Tighe A. Spurlin, Jonathan D. Reid
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AssigneeLam Research Corporation
InventorsEdward C. Opocensky, Tighe A. Spurlin, Jonathan D. Reid
Estimating the term…
Method and apparatus for characterizing metal oxide reduction using metal oxide films formed in an anneal chamber are disclosed. Oxygen is provided into an anneal chamber. A substrate including a metal seed layer is exposed to the oxygen and exposed to a heated substrate support in the anneal chamber to form a metal oxide of the metal seed layer. The oxidized substrate can be stored for later use or transferred to a processing chamber for reducing the metal oxide to metal. The oxidized substrates formed in this manner provide metal oxides that are repeatable, uniform, and stable. The oxidized substrate is exposed to a reducing treatment under conditions that reduce the metal oxide to metal in the form of a film integrated with the metal seed layer.
A method of characterizing metal oxide reduction, the method comprising:
An apparatus for characterizing metal oxide reduction, the apparatus comprising:
Dependencies are inferred from the claim text.