Semiconductor device including gate channel having adjusted threshold voltage
AssigneeInternational Business Machines Corporation
InventorsPranita Kerber, Qiqing C. Ouyang, Alexander Reznicek
Life of this patent
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Abstract
A semiconductor device includes at least one first semiconductor fin formed on an nFET region of a semiconductor device and at least one second semiconductor fin formed on a pFET region. The at least one first semiconductor fin has an nFET channel region interposed between a pair of nFET source/drain regions. The at least one second semiconductor fin has a pFET channel region interposed between a pair of pFET source/drain regions. The an epitaxial liner is formed on only the pFET channel region of the at least one second semiconductor fin such that a first threshold voltage of the nFET channel region is different than a second threshold voltage of the pFET channel.
Claims6
A method of controlling a voltage threshold of a semiconductor device, the method comprising:
- forming an nFET region on a semiconductor substrate, and at least one first semiconductor fin having a fin thickness on the nFET region, the at least one first semiconductor fin having an nFET channel region interposed between a pair of nFET source/drain regions;
- forming a plurality of pFET regions on the semiconductor substrate, and forming a second semiconductor fin on each pFET region, the second semiconductor fin having a pFET channel region interposed between a pair of pFET source/drain regions;
- and
- forming a plurality of epitaxial liners having different doping concentrations with respect to one another, each epitaxial liner formed in a respective pFET region such that a first threshold voltage of the nFET channel region is different than a second threshold voltage of the pFET channel region of a respective second semiconductor fin, the epitaxial liners including an etched pFET channel portion,
- wherein a combination of the etched pFET channel portion and the epitaxial liners defines a combined thickness that is equal to the fin thickness of the at least one first semiconductor fin.
Dependencies are inferred from the claim text.