Semiconductor manufacturing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsShinya FUKAYAMA, Yukifumi OYAMA, Satoshi TSUKIYAMA, Masatoshi FUKUDA
Life of this patent
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Abstract
A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip.
Claims20
A semiconductor manufacturing method comprising:
- positioning a collet including a suction surface having a recessed portion such that a position of the recessed portion corresponds to a position of a bump on a semiconductor chip, the suction surface configured to hold the semiconductor chip having a main surface on which the bump has been formed, the main surface of the semiconductor chip to be held by vacuum suction to the suction surface;
- and
- transferring the semiconductor chip onto a mounting substrate or another semiconductor chip by manipulation of the collet, wherein
- an elastic material having a thickness of about 10 μm to about 50 μm is disposed on the recessed portion.
A semiconductor manufacturing method, comprising:
- transferring a semiconductor chip using a collet having a suction surface that holds a main surface of the semiconductor chip on which a plurality of bumps are formed, the suction surface having a plurality of recessed portions formed therein at positions corresponding to each of the bumps;
- wherein
- an actuator positions the collet such that the plurality of recessed portions and the plurality of bumps are at corresponding positions before transferring the semiconductor chip onto a mounting substrate or another semiconductor chip by moving of the collet, and
- the plurality of recessed portions are sized to avoid a contact between the collet and the plurality of bumps on the semiconductor chip.
A semiconductor manufacturing method comprising:
- transferring a semiconductor chip using a collet configured to hold the semiconductor chip on a main surface thereof and on which a plurality of bumps are formed, the collet having a suction surface configured to hold the main surface of the semiconductor chip by suction, the suction surface having a plurality of recessed portions formed therein at positions that correspond to positions of the plurality of bumps;
- and
- positioning the collet using an actuator configured to position the collet such that the plurality of recessed portions and the plurality of bumps are at corresponding positions before transferring and transfers the semiconductor chip onto a mounting substrate or another semiconductor chip by movement of the collet, wherein
- the plurality of recessed portions formed on the suction surface of the collet are sized to avoid a contact between the collet and the plurality of bumps on the semiconductor chip, and
- an elastic material having a thickness of about 10 μm to about 50 μm is disposed in each of the plurality of recessed portions.
Dependencies are inferred from the claim text.