Debonding Schemes
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsXin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai
Life of this patent
Estimating the term…
Abstract
A method includes receiving a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debonded from the second wafer using the at least one blade. In another embodiment, a detacher having a convex bottom surface is attached to the wafer stack. The first wafer is debonded from the second wafer using the detacher.
Claims22
A method, comprising:
- receiving a wafer stack having at least two wafers bonded together;
- inserting at least one blade between a first wafer of the at least two wafers and a second wafer of the at least two wafers, wherein the at least one blade has a channel configured to inject air or fluid;
- and
- separating the first wafer from the second wafer using the at least one blade.
10-13. (canceled)
A method, comprising:
- receiving a wafer stack having at least two wafers, wherein the at least two wafers includes a first wafer and a second wafer bonded together;
- attaching a detacher having a convex bottom surface to the wafer stack, wherein the convex bottom surface faces a top surface of the wafer stack;
- and
- separating the first wafer from the second wafer using the detacher.
19-20. (canceled)
A method, comprising:
- receiving a wafer stack comprising at least two wafers, the at least two wafers including a first wafer and a second wafer bonded together;
- mounting the wafer stack on a bottom stage;
- attaching a detacher to a top surface of the wafer stack, the detacher having a body and a rotation axis, the body having a convex bottom surface, at least a portion of the convex bottom surface contacting the top surface of the wafer stack;
- rotating the detacher;
- blowing air at an area between the first wafer and the second wafer;
- and
- separating the first wafer from the second wafer using the detacher.
Dependencies are inferred from the claim text.