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US 2016/0111311 A1Published application
Wafer transfer method and system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Fa LEE, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO
Life of this patent
Estimating the term…
Abstract
A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.
Claims23
A wafer transfer method, comprising:
- moving a wafer transfer blade to a picking entry position in a wafer cassette;
- detecting an initial position of a first wafer in the wafer cassette and a position of a second wafer located above the first wafer;
- determining a picking exit position in the wafer cassette based on the initial position of the first wafer and the position of the second wafer, wherein the picking exit position is located between the initial position of the first wafer and the position of the second wafer;
- and
- moving the wafer transfer blade from the picking entry position to the picking exit position to lift the first wafer to the picking exit position.
2 more elements
(canceled)
A wafer transfer method, comprising:
- moving a wafer transfer blade to a picking entry position in a wafer cassette;
- obtaining mapping data with respect to a first wafer in the wafer cassette and mapping data with respect to a second wafer located above the first wafer;
- determining a picking exit position in the wafer cassette that deviates from the second wafer based on the mapping data with respect to the first wafer and the mapping data with respect to the second wafer;
- and
- moving the wafer transfer blade from the picking entry position to the picking exit position to lift the first wafer to the picking exit position.
2 more elements
(canceled)
A wafer transfer system, comprising:
- a wafer mapping sensor configured to detect an initial position of a first wafer in a wafer cassette and a position of a second wafer located above the first wafer;
- a picking exit determining unit configured to determine a picking exit position in the wafer cassette based on the initial position of the first wafer and the position of the second wafer, wherein the picking exit position is higher than the initial position of the first wafer and lower than the position of the second wafer;
- a wafer transfer blade;
- and
- a controller configured to move the wafer transfer blade to lift the first wafer to the picking exit position.
2 more elements
(canceled)
Dependencies are inferred from the claim text.