Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• placing, on a heat sink made of a metal, a semiconductor element and a frame surrounding the semiconductor element;
• placing solder on an upper surface of the frame;
• placing a cap on the solder and the frame to thereby create, in a first region, a direct abutment between the cap and the frame, and, in a second region, an arrangement in which the solder is positioned between the cap and the frame, wherein the first region is positioned between the second region and the semiconductor element;
• and
• heating step for heating the solder while exerting on the cap a force to be applied toward the frame without scrubbing the cap on the frame;
• wherein in the heating step a heat source is brought into contact with the heat sink and the solder is heated with the heat source, and
• wherein the abutment between the cap and the frame in the first region prevents the solder from intruding from the second region into an interior of the semiconductor device.