Substrate processing apparatus, linked processing system, and substrate processing method
AssigneeTokyo Electron Limited
InventorJong Won Yun
Life of this patent
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Abstract
A substrate processing apparatus comprises: a substrate holding unit configured to hold and rotate a substrate; an etching unit configured to etch a surface of a substrate by discharging a processing liquid to the substrate rotated by the substrate holding unit; and a control unit configured to control an etching amount by the etching unit. In the substrate processing apparatus, the control unit controls an etching amount at each position on the surface of the substrate based on information upon a characteristic of a surface processing to be performed on the substrate by a post-processing apparatus which is configured to perform a post-processing after a substrate processing by the substrate processing apparatus.
Claims18
A substrate processing apparatus, comprising:
- a substrate holding unit configured to hold and rotate a substrate;
- an etching unit configured to etch a surface of a substrate by discharging a processing liquid to the substrate rotated by the substrate holding unit;
- and
- a control unit configured to control an etching amount by the etching unit,
- wherein the control unit controls an etching amount at each position on the surface of the substrate based on information upon a characteristic of a surface processing to be performed on the substrate by a post-processing apparatus which is configured to perform a post-processing after a substrate processing by the substrate processing apparatus.
A linked processing system, comprising:
- a pre-processing apparatus configured to perform a pre-processing on a surface of a substrate;
- a substrate processing apparatus configured to perform an etching processing on the surface of the substrate after the pre-processing;
- a post-processing apparatus configured to perform a post-processing on the surface of the substrate after the etching processing;
- and
- a host device connected to the pre-processing apparatus, the substrate processing apparatus and the post-processing apparatus,
- wherein the host device acquires information upon a characteristic of a surface processing to be performed on the substrate by the post-processing apparatus, and sends the acquired information to a control unit within the substrate processing apparatus, and
- the control unit controls an etching amount at each position on the surface of the substrate in the substrate processing apparatus based on the information upon the characteristic of the surface processing to be performed on the substrate by the post-processing apparatus.
A substrate processing method, comprising:
- performing a pre-processing on a surface of a substrate;
- acquiring information upon a characteristic of a surface processing to be performed on the substrate in a post-processing after an etching processing;
- performing the etching processing on the surface of the substrate by discharging a processing liquid to the surface of the substrate while controlling an etching amount at each position on the surface of the substrate based on the information upon the characteristic of the surface processing in the post-processing;
- and
- performing the post-processing on the surface of the substrate after the etching processing.
Dependencies are inferred from the claim text.