Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsYu WAMURA, Fumiaki HAYASE, Masahiko KAMINISHI, Yu SASAKI, Kosuke TAKAHASHI
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Abstract
A substrate processing method is provided. In the method, a plurality of substrates is placed on a plurality of substrate holding areas provided in a surface of a turntable at predetermined intervals in a circumferential direction, the turntable being provided in a processing chamber. Next, the turntable on which the plurality of substrates is placed is rotated. Then, a fluid is supplied to the surface of the turntable while rotating the turntable. Here, the fluid is supplied to an area between the plurality of substrate holding areas in response to an operation of changing a flow rate of the fluid.
Claims19
A substrate processing method, the method comprising:
- placing a plurality of substrates on a plurality of substrate holding areas provided in a surface of a turntable at predetermined intervals in a circumferential direction, the turntable being provided in a processing chamber;
- rotating the turntable on which the plurality of substrates is placed;
- and
- supplying a fluid to the surface of the turntable while rotating the turntable, the fluid being supplied to an area between the plurality of substrate holding areas in response to an operation of changing a flow rate of the fluid.
A substrate processing apparatus, comprising:
- a processing chamber;
- a turntable provided in the processing chamber;
- a plurality of substrate holding areas provided in an upper of the turntable at predetermined intervals in a circumferential direction;
- a fluid supply unit configured to supply a fluid to the upper surface of the turntable;
- a controller configured to cause the fluid supply unit to supply the fluid to an area between the plurality of substrate holding areas by synchronizing an operation of changing a flow rate of the fluid while rotating the turntable.
Dependencies are inferred from the claim text.