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US 2016/0111255 A1Published application
Separation of Chips on a Substrate
AssigneeInfineon Technologies AG
InventorsManfred Engelhardt, Gudrun Stranzl, Markus Zundel, Hubert Maier
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Abstract
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.
Claims11
An apparatus comprising:
- a partial dicing device configured to partially dice a substrate into a plurality of partially separated parts;
- and
- a complete separation device configured to completely separate the partially separated parts from each other.
Dependencies are inferred from the claim text.