US 2016/0111216 A1 · CHIP COMPONENT

Abstract

A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.

Claims16

Dependent claims

A chip component comprising:

a ceramic body including a capacitance forming part in which a plurality of first and second dielectric layers are alternately disposed;
and
external electrodes disposed on both end surfaces of the ceramic body in a length direction thereof,
wherein the capacitance forming part includes:
first and second internal electrodes disposed on the plurality of first dielectric layers to be spaced apart from each other and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes;
and
floating electrodes disposed on the plurality of second dielectric layers and overlapped with portions of the first and second internal electrodes,
the ceramic body further includes protective parts disposed between at least one of upper and lower surfaces of the ceramic body and the capacitance forming part and having a plurality of third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and
the protective parts further include third dummy electrodes disposed between the first and second dummy electrodes.

6 more elements

A chip component comprising:

a ceramic body including a capacitance forming part in which a plurality of first and second dielectric layers are alternately disposed, and first and second protective parts respectively disposed on one surface and the other surface of the capacitance forming part in a thickness direction thereof;
first and second external electrodes disposed on both end surfaces of the ceramic body in a length direction thereof, respectively;
first and second internal electrodes disposed on the plurality of first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the first and second external electrodes, respectively;
and
floating electrodes disposed on the plurality of second dielectric layers and positioned in a central portion of the ceramic body in the length direction thereof to thereby be overlapped with portions of the first and second internal electrodes,
wherein the first and second protective parts include a plurality of third dielectric layers on which first dummy electrodes positioned in the central portion of the ceramic body in the length direction thereof are disposed, the first dummy electrodes being overlapped with portions of the floating electrodes.

3 more elements

Dependencies are inferred from the claim text.

Chip component

Life of this patent

Chip component

Life of this patent

Abstract

Claims16