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US 2016/0111215 A1Published application
Chip electronic component and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Soo PARK, Soon Ju LEE, Young Ghyu AHN, Heung Kil PARK
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Abstract
There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.
Claims10
A chip electronic component comprising:
- a ceramic body;
- external electrodes provided on both side portions of the ceramic body;
- and
- an interposer supporting the ceramic body and electrically connected to the external electrodes,
- wherein the interposer includes:
- first and second terminal electrodes provided on both side portions thereof;
- and
- recesses provided inwardly in the first and second terminal electrodes.
5 more elements
A board having a chip electronic component, the board comprising:
- a chip electronic component including a ceramic body, external electrodes provided on both side portions of the ceramic body, and an interposer supporting the ceramic body, electrically connected to the external electrodes, and including first and second terminal electrodes provided on both side portions thereof and recesses provided inwardly in the first and second terminal electrodes;
- and
- a printed circuit board including land patterns provided thereon, the land patterns being electrically connected to the first and second terminal electrodes to conduct electricity to the chip electronic component.
Dependencies are inferred from the claim text.