Chip component and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorBong Sup LIM
Life of this patent
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Abstract
There are provided a chip component and a manufacturing method thereof. The chip component according to an exemplary embodiment of the present disclosure includes: a multilayer body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; first external electrodes disposed on the bottom surface of the multilayer body; and second external electrodes disposed on both end surfaces of the multilayer body in a length direction of the multilayer body and the bottom surface of the multilayer body, wherein the second external electrodes are disposed to cover at least portions of the first external electrodes.
Claims14
A chip component comprising:
- a multilayer body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface;
- first external electrodes disposed on the bottom surface of the multilayer body;
- and
- second external electrodes disposed on both end surfaces of the multilayer body in a length direction of the multilayer body and the bottom surface of the multilayer body,
- wherein the second external electrodes are disposed to cover at least portions of the first external electrodes.
A chip component comprising:
- a multilayer body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface;
- internal electrodes having internal conductor patterns disposed on the plurality of insulating layers;
- first external electrodes disposed on the bottom surface of the multilayer body;
- and
- second external electrodes disposed on both end surfaces of the multilayer body in a length direction of the multilayer body and the bottom surface of the multilayer body and connected to the internal electrodes;
- and
- step portions formed by disposing the second external electrodes on at least portions of the first external electrodes.
A method of manufacturing a chip component, the method comprising:
- preparing a plurality of insulating layers;
- forming internal conductor patterns on the plurality of insulating layers;
- forming a multilayer body including internal electrodes by stacking the plurality of insulating layers on which the internal conductor patterns are formed;
- forming first external electrodes on a bottom surface of the multilayer body provided as a mounting surface of the multilayer body using a printing process;
- and
- forming second external electrodes on both end surfaces of the multilayer body in a length direction of the multilayer body using a dipping process,
- wherein the second external electrodes are disposed to cover at least portions of the first external electrodes.
Dependencies are inferred from the claim text.