A method of manufacturing an embedded magnetic component device, comprising:
- a) preparing an insulating substrate including a first side and a second side opposite the first side, and including a toroidal cavity therein, the toroidal cavity including an inner and an outer periphery;
- b) installing a magnetic core in the toroidal cavity;
- c) forming an electrical winding that extends through the insulating substrate and around the magnetic core, the electrical winding including:
- upper conductive traces located on the first side of the insulating substrate;
- lower conductive traces located on the second side of the insulating substrate;
- inner conductive connectors extending through the insulating substrate adjacent to the inner periphery of the magnetic core, the inner conductive connectors respectively defining electrical connections between respective upper conductive traces and respective lower conductive traces;
- and
- outer conductive connectors extending through the insulating substrate adjacent to the outer periphery of the magnetic core, the outer conductive connectors respectively defining electrical connections between respective first upper conductive traces and respective first lower conductive traces;
- and
- d) in step c) forming the outer conductive connectors to include a first set of outer conductive connectors and a second set of outer conductive connectors;
- wherein
- the first set of outer conductive connectors are located along the outer periphery of the toroidal cavity and are spaced from the outer periphery of the toroidal cavity by a first distance;
- and
- the second set of the outer conductive connectors are located adjacently without the first set of outer conductive connectors in between and at a greater distance from the outer periphery of the toroidal cavity than the first set of outer conductive connectors;
- each one of the first and second set of outer conductive connectors is electrically connected to one of the inner conductive connectors through one of the upper conductive traces or one of the lower conductive traces
- two outer conductive connectors of the second set of outer conductive connectors are located directly adjacent to respective ones of the first set of outer conductive connectors;
- in a thickness direction of the insulating substrate, either:
- the upper conductive traces connected to the first set of outer conductive connectors do not overlap with the upper conductive traces connected to the second set of outer conductive connectors;
- or
- the lower conductive traces connected to the first set of outer conductive connectors do not overlap with the lower conductive traces connected to the second set of outer conductive connectors;
- and
- adjacent inner conductive connectors connected to the second set of the outer conductive connectors are located at different distances from the cavity.