Chip electronic component and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorDong Jin JEONG
Life of this patent
Estimating the term…
Abstract
There is provided a chip electronic component including: an insulating substrate; a first internal coil part which is disposed on one surface of the insulating substrate; a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via, wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1≦b/a<2.3 is satisfied.
Claims17
A chip electronic component comprising:
- an insulating substrate;
- a first internal coil part which is disposed on one surface of the insulating substrate;
- a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate;
- a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other;
- and
- first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via,
- wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1≦b/a<2.3 is satisfied.
A chip electronic component comprising:
- an insulating substrate;
- a first internal coil part which is disposed on one surface of the insulating substrate;
- a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate;
- a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other;
- and
- first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via,
- wherein when a thickness of each of a coil pattern of the first and second coil parts is c and a thickness of each of the first and second via pads is d, d/c is 1 or less.
Dependencies are inferred from the claim text.