Chip electronic component and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorDong Jin JEONG
Life of this patent
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Abstract
A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns
Claims19
A chip electronic component comprising:
- a magnetic body including an insulating substrate;
- and
- an internal coil part formed on at least one surface of the insulating substrate,
- wherein the internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on one or more of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.
A chip electronic component comprising:
- a magnetic body including an insulating substrate;
- and
- an internal coil part formed on at least one surface of the insulating substrate,
- wherein the internal coil part includes first coil patterns formed on the insulating substrate and second coil patterns disposed on the first coil patterns, and interface parts distinguished from the first and second coil patterns are disposed on interfaces between the first and second coil patterns.
A chip electronic component comprising:
- a magnetic body including an insulating substrate;
- and
- an internal coil part formed on at least one surface of the insulating substrate,
- wherein the internal coil part includes a pattern plating layer disposed on the insulating substrate, an isotropic plating layer coating the pattern plating layer, and an anisotropic plating layer disposed on the isotropic plating layer, and
- an interface part having a crystal phase distinguished from crystal structures of the pattern plating layer, the isotropic plating layer, and the anisotropic plating layer is disposed on at least one of an interface between the pattern plating layer and the isotropic plating layer and an interface between the isotropic plating layer and the anisotropic plating layer.
A method of manufacturing a chip electronic component, comprising:
- forming an internal coil part on at least one surface of an insulating substrate;
- and
- disposing magnetic layers on and beneath the insulating substrate on which the internal coil part is formed, to form a magnetic body,
- wherein the forming of the internal coil part includes:
- forming first coil patterns on the insulating substrate, forming second coil patterns on the first coil patterns, and forming third coil patterns on the second coil patterns, and
- interface parts having crystal structures distinguished from crystal structures of the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.
Dependencies are inferred from the claim text.