Cooling device and electronic apparatus
AssigneeFujitsu Limited
InventorNaoaki Nakamura
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AssigneeFujitsu Limited
InventorNaoaki Nakamura
Estimating the term…
A cooling device that is thermally connected to a heat source and cools the heat source by means of a heat medium flowing inside the cooling device, includes: a first passage configured such that the heat medium before being heated by the heat source flows through the first passage; a second passage configured such that the heat medium after being heated by the heat source flows through the second passage; a plurality of heat exchanging chambers each configured such that in the heat exchanging chamber, the heat medium is heated by heat generated by the heat source; a first communicating passage provided in each of the plurality of heat exchanging chambers and configured such that through the first communicating passage, the first passage and the heat exchanging chamber communicate with each other; a second communicating passage provided in each of the plurality of heat exchanging chambers.
A cooling device that is thermally connected to a heat source and cools the heat source by means of a heat medium flowing inside the cooling device, comprising:
An electronic apparatus that includes an electronic component including a heat source and a cooling device thermally connected to the heat source,
Dependencies are inferred from the claim text.