Heat dissipation structure for mobile device
AssigneeAsia Vital Components Co., Ltd.
InventorChing-Hang Shen
Life of this patent
Estimating the term…
Abstract
A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling module set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling module has a cold surface and an opposite hot surface. The cooling module is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein.
Claims6
A heat dissipation structure for mobile device, comprising:
- an element holding member including a holding portion and a cooling module set on the holding portion;
- the holding portion having a first side and an opposite second side, and the cooling module having a cold surface and an opposite hot surface;
- and the cooling module being set on the holding portion with the cold surface and the hot surface being flush with the first side and the second side, respectively.
Dependencies are inferred from the claim text.