Support frame with integrated phase change material for thermal management
AssigneeFuturewei Technologies, Inc.
InventorQian HAN
Life of this patent
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Abstract
The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.
Claims20
A mobile computing device, comprising:
- a front panel;
- a back panel;
- a mid-frame, the mid-frame being configured to provide mechanical support for the mobile computing device and disposed between the front panel and the back panel;
- a plurality of components comprising at least one processor;
- and
- a phase change material integrated within the mid-frame for absorbing heat produced by the plurality of components.
A thermal management device comprising:
- a mid-frame configured to provide mechanical support for a mobile computing device;
- and
- a phase change material integrated within an interior of the mid-frame.
An apparatus for providing thermal management, the apparatus comprising:
- a rechargeable power source comprised in a mobile computing device and configured to provide power for the mobile computing device;
- a rechargeable power source cover comprised in the mobile computing device and configured to provide mechanical support for the rechargeable power source;
- and
- a first phase change material integrated in the rechargeable power source cover and configured to absorb heat produced by the rechargeable power source.
Dependencies are inferred from the claim text.