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US 2016/0109665 A1Published application
Optical module with glass slide
AssigneeFoxconn Interconnect Technology Limited
InventorsCHUN-YI CHANG, JIA-HAU LIU
Life of this patent
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Abstract
An optoelectronic assembly includes a printed circuit board (PCB), a glass carrier positioned upon the PCB and equipped with thereon an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, an optical waveguide embedded within the PCB, and a ferrule located around the optical waveguide to couple an external optical device thereto for optical transmission therebetween.
Claims20
An optoelectronic assembly comprising:
- a printed circuit board (PCB);
- a carrier mounted upon the PCB in a vertical direction;
- an active component for optoelectronic conversion mounted upon the carrier with a heat dissipation surface opposite to the PCB and exposed to an exterior;
- and
- an integrated circuit (IC) mounted upon the carrier and electrically connected to the active component via conductive traces.
2 more elements
An optoelectronic assembly comprising:
- a printed circuit board (PCB) defining an optical connection port and an electrical connection port;
- a carrier mounted upon the PCB in a vertical direction, and defining opposite optical side and electrical side in a horizontal direction perpendicular to said vertical direction, corresponding to said optical connection port and said electrical connection port;
- an active component for optoelectronic conversion mounted upon the optical side of the carrier;
- and
- an integrated circuit (IC) mounted upon the electrical side of the carrier;
- wherein
- the active component and the IC are electrically connected via conductive traces.
4 more elements
An optoelectronic assembly comprising:
- a printed circuit board (PCB);
- a carrier mounted upon the PCB in a vertical direction;
- an active component for optoelectronic conversion mounted upon the carrier with a heat dissipation surface opposite to the PCB and exposed to an exterior;
- and
- a first lens located under the active component and between the carrier and the PCB in the vertical direction.
2 more elements
Dependencies are inferred from the claim text.