Optical module assembly with improved printed circuit board
AssigneeFoxconn Interconnect Technology Limited
InventorsCHUN-YI CHANG, JIA-HAU LIU
Life of this patent
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Abstract
An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.
Claims20
An optoelectronic assembly comprising:
- a printed circuit board (PCB) defining vertically opposite first and second sides thereof in a vertical direction;
- an active component for optoelectronic conversion mounted upon the first side with a heat dissipation surface exposed to an exterior;
- and
- an integrated circuit (IC) mounted upon the first side and electrically connected to the active component via conductive traces.
An optoelectronic assembly comprising:
- a printed circuit board (PCB) defining an optical connection region and an electrical connection region opposite to each other along a longitudinal direction;
- an active component for optoelectronic conversion and an integrated circuit (IC) commonly mounted upon the optical connection region;
- wherein
- the active component and the IC are electrically connected via conductive traces via a flip chip technology.
An optoelectronic assembly comprising:
- a printed circuit board (PCB) defining opposite first and second surfaces in the vertical direction;
- an active component for optoelectronic conversion mounted upon the first surface with a heat dissipation surface opposite to the PCB and exposed to an exterior;
- and
- a lens module mounted upon the second surface with lenses communicatively aligned with the active component in the vertical direction by way of corresponding via holes formed in the PCB.
Dependencies are inferred from the claim text.