Semiconductor package test blade and semiconductor package test apparatus including the same

Abstract

A semiconductor package test blade and a semiconductor package test apparatus may prevent damage to a semiconductor package and occurrence of failures in the semiconductor package during a pass/fail test on the semiconductor package. The semiconductor package test blade includes a blade body formed at a lower end portion of a pusher for testing a semiconductor package, the blade body having a first surface contacting the semiconductor package and a groove dented upward from the first surface, a vacuum suction picker configured to penetrate a central portion of the blade body and suck and pick up the semiconductor package in vacuum, and a flexible silicone layer filling the groove. A bottom surface of the flexible silicone layer may be positioned at substantially the same level as the first surface of the blade body.

Dependencies are inferred from the claim text.