Test board support platform for supporting a test board
AssigneeFreescale Semiconductor, Inc.
InventorsCHRISTIAN JEAN-GABRIEL VINCENT, JEAN DALMON, PIERRE MICHEL GEORGES JALBAUD
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Abstract
The invention provides a test board support platform for supporting a test board during tests, the platform comprising a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface. The support platform also comprises a thermal conditioner coupled to a second side of the heat conductive interface, the second side being opposite the first side. By using this test board support platform a test board can be supported and thermally controlled in a way so that a DUT positioned on the test board can be probed from above, while the temperature is controlled from below.
Claims17
A test board support platform for supporting during tests a test board with a high-frequency integrated circuit mounted thereon, the test board support platform comprising:
- a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface;
- a thermal conditioner for regulating a temperature of the test board, the thermal conditioner being coupled to a second side of the heat conductive interface, the second side being opposite the first side.
A system for testing integrated circuits, the system comprising:
- a table comprising a hole;
- a nest support plate adjustably positioned on a first side of the table at a location of the hole and comprising a further hole for receiving a test board nest;
- a test board support platform according to any of the preceding claims;
- an actuator arranged at a second side of the table, opposite the first side, the actuator being arranged to move the test board support platform from a load position at the second side of the table to a test position where the test board is positioned in the test board nest, so that the test board is accessible from the first side of the table.
A method of supporting a test board during tests, the method comprising:
- placing a test board on a heat conductive interface with a bottom side of the test board facing a first side of the heat conductive interface;
- coupling a thermal conditioner to a second side of the heat conductive interface, the second side being opposite the first side;
- activate the thermal conditioner to regulate a temperature of the test board and, if present, of a device under test mounted on the test board.
Dependencies are inferred from the claim text.