US 2016/0109508 A1 · HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD

Abstract

A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

Claims13

Dependent claims

A substrate inspection apparatus comprising:

a mounting table configured to mount thereon a substrate on which a semiconductor device is formed;
an inspection unit configured to inspect electrical characteristics of the semiconductor device on the mounted substrate;
a temperature control unit configured to control a temperature of the mounting table;
and
a medium channel passing through the mounting table,
wherein the temperature control unit includes:
a high-temperature medium supply unit configured to supply a high-temperature medium to the medium channel;
a low-temperature medium supply unit configured to supply a low-temperature medium to the medium channel;
and
a medium mixing unit configured to mix the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

7 more elements

A substrate temperature control method in a substrate inspection apparatus, the substrate inspection apparatus comprising:

a mounting table configured to mount thereon a substrate on which a semiconductor device is formed;
an inspection unit configured to inspect electrical characteristics of the semiconductor device formed on the mounted substrate;
a temperature control unit configured to control a temperature of the mounting table;
and a medium channel passing through the mounting table, wherein the temperature control unit includes a high-temperature medium supply unit configured to supply a high-temperature medium to the medium channel and a low-temperature medium supply unit configured to supply a low-temperature medium to the medium channel, the method comprising:
mixing the high-temperature medium and the low-temperature medium and supplying the mixture of the high-temperature medium and the low-temperature medium to the medium channel.

2 more elements

Dependencies are inferred from the claim text.

Heat treatment apparatus and heat treatment method

Life of this patent

Heat treatment apparatus and heat treatment method

Life of this patent

Abstract

Claims13